A service based wireless sensor networks architecture for high value-added process monitoring

Umar Raza, R. Kharel, Mohammad Hammoudeh, S. Ekpo, B. Whiteside
{"title":"A service based wireless sensor networks architecture for high value-added process monitoring","authors":"Umar Raza, R. Kharel, Mohammad Hammoudeh, S. Ekpo, B. Whiteside","doi":"10.1109/CSNDSP.2016.7574027","DOIUrl":null,"url":null,"abstract":"Current research in high value-added manufacturing processes, such as the Micro Injection Molding (μIM) process, focuses on the monitoring of the machine process data., which could potentially affect the quality of the end product. Up until now, machine process monitoring has been limited to the machine level and has often bypassed the ambient environmental factors and pre manufacturing factors, which could have direct impact on the end product quality. In light of this, extending the monitoring of high value-added processes to include the ambient manufacturing environment would have numerous benefits in terms of process monitoring accuracy, material condition and product quality. In this paper, we present a novel Service Orientated Architecture (SOA) for monitoring a high value-added manufacturing process and its ambient environment using Wireless Sensor Networks (WSN). The proposed architecture applies the SOA to a network of wireless sensor nodes installed in the uIM machine and the industrial micro-molding environment. Here we present; the generic architectural design, system integration, user interfaces, and initial test results for an experimental testbed system.","PeriodicalId":298711,"journal":{"name":"2016 10th International Symposium on Communication Systems, Networks and Digital Signal Processing (CSNDSP)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 10th International Symposium on Communication Systems, Networks and Digital Signal Processing (CSNDSP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSNDSP.2016.7574027","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Current research in high value-added manufacturing processes, such as the Micro Injection Molding (μIM) process, focuses on the monitoring of the machine process data., which could potentially affect the quality of the end product. Up until now, machine process monitoring has been limited to the machine level and has often bypassed the ambient environmental factors and pre manufacturing factors, which could have direct impact on the end product quality. In light of this, extending the monitoring of high value-added processes to include the ambient manufacturing environment would have numerous benefits in terms of process monitoring accuracy, material condition and product quality. In this paper, we present a novel Service Orientated Architecture (SOA) for monitoring a high value-added manufacturing process and its ambient environment using Wireless Sensor Networks (WSN). The proposed architecture applies the SOA to a network of wireless sensor nodes installed in the uIM machine and the industrial micro-molding environment. Here we present; the generic architectural design, system integration, user interfaces, and initial test results for an experimental testbed system.
一种基于服务的无线传感器网络体系结构,用于高附加值过程监控
目前对高附加值制造工艺的研究,如微注射成型(μIM)工艺,主要集中在机器过程数据的监测上。,这可能会影响最终产品的质量。到目前为止,机器过程监控一直局限于机器层面,往往忽略了对最终产品质量有直接影响的环境因素和制造前因素。鉴于此,将高附加值过程的监控扩展到包括周围的制造环境,将在过程监控精度、材料状况和产品质量方面带来许多好处。在本文中,我们提出了一种新的面向服务的体系结构(SOA),用于使用无线传感器网络(WSN)监控高附加值的制造过程及其周围环境。所提出的体系结构将SOA应用于安装在uIM机器和工业微成型环境中的无线传感器节点网络。在这里我们呈现;一个试验台系统的通用架构设计、系统集成、用户界面和初始测试结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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