Aluminium Induced Vapor Phase Stain Etch Method for Generating Porous Silicon Structure

Joyita Biswas, R. Barui, Sayantani Das, S. Bandyopadhyay
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Abstract

This work ensemble the structural features of Porous Silicon (PS) layers which are being fabricated employing modified stain etch method. Additionally, this study also categorizes the optimal etching parameters which are extensively used to grow Porous Silicon (PS) layers enabling Metal Induced Vapor Phase Stain Etching methodology. Various growth conditions are considered to fabricate uniform porous structures. The structural morphology of PS layers has been studied in scanning electron microscopy (SEM) that reveals macroporous nature of pore morphology supported by investigation of optical properties. This has been supported by characterizing ultraviolet-visible (UV-VIS) spectrophotometer absorption spectra. Surface and optical investigations discover uniform porous structure which augments the size of silicon substrate. This augmented surface of planar silicon substrate can be used as sensing platform for different kinds of sensors.
铝诱导气相染色蚀刻制备多孔硅结构的方法
本工作综合了采用改良染色蚀刻法制备多孔硅(PS)层的结构特点。此外,本研究还对广泛用于生长多孔硅(PS)层的最佳蚀刻参数进行了分类,从而实现了金属诱导气相染色蚀刻方法。考虑了不同的生长条件来制造均匀的多孔结构。扫描电子显微镜(SEM)研究了PS层的结构形态,揭示了孔隙形态的大孔性质,并对光学性质进行了研究。这已被表征的紫外-可见(UV-VIS)分光光度计吸收光谱支持。表面和光学研究发现均匀的多孔结构增加了硅衬底的尺寸。这种平面硅衬底的增广表面可以作为各种传感器的传感平台。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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