Wafer bonded silicon photonics

Abstract

Compound semiconductors-silicon integration has never been of such great demand until the recent difficulty to maintain Moore's law in the microelectronics industry. Recently, we have developed a hybrid silicon evanescent platform (HSEP), which enables the coherent marriage of incompatible characteristics of III-V and silicon, i.e., direct bandgap and high mobility at III-V side and mature CMOS manufacturability and low-optical loss at silicon side. A series of critical components including lasers, amplifiers, photodetectors, and modulators have been successfully implemented in this platform.