20% Efficient screen-printed and aluminum-alloyed back-contact back-junction cells and interconnection scheme of point-shaped metalized cells

2011 37th IEEE Photovoltaic Specialists Conference Pub Date : 2011-06-19 DOI:10.1109/PVSC.2011.6185843

R. Woehl, R. Keding, M. Rudiger, H. Gentischer, F. Clement, J. Wilde, D. Biro

{"title":"20% Efficient screen-printed and aluminum-alloyed back-contact back-junction cells and interconnection scheme of point-shaped metalized cells","authors":"R. Woehl, R. Keding, M. Rudiger, H. Gentischer, F. Clement, J. Wilde, D. Biro","doi":"10.1109/PVSC.2011.6185843","DOIUrl":null,"url":null,"abstract":"A back-contact back-junction silicon solar cell is presented that was exclusively structured and metalized by screen-printing technology. On n-type base material the emitter was formed by locally printed and alloyed aluminum structures in a co-firing process. By a varying emitter coverage on the rear the influence on the collection probability and thus the short-circuit current density is analyzed by light beam induced current (LBIC) measurements. Efficiencies of up to 20% were realized and independently confirmed by Fraunhofer ISE CalLab. Two-dimensional simulations of the cell structure are performed and agree well with the processed cell. Variations of several parameters show room for further efficiency increase. Furthermore a new module concept for back-contact cells is presented where the metallization on cell level is point-shaped. The lateral conductance of collected carriers is enabled on module level by a structured printed circuit board. On the contacts an adhesive agent is screen-printed in order to make the aluminum contacts solderable. Afterwards a soldering paste is screen-printed which connects the cell and the printed circuit board or foil during a reflow process. This concept overcomes the restriction in cell size of back-contact back-junction modules due to thick copper layer.","PeriodicalId":373149,"journal":{"name":"2011 37th IEEE Photovoltaic Specialists Conference","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 37th IEEE Photovoltaic Specialists Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PVSC.2011.6185843","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 9

Abstract

A back-contact back-junction silicon solar cell is presented that was exclusively structured and metalized by screen-printing technology. On n-type base material the emitter was formed by locally printed and alloyed aluminum structures in a co-firing process. By a varying emitter coverage on the rear the influence on the collection probability and thus the short-circuit current density is analyzed by light beam induced current (LBIC) measurements. Efficiencies of up to 20% were realized and independently confirmed by Fraunhofer ISE CalLab. Two-dimensional simulations of the cell structure are performed and agree well with the processed cell. Variations of several parameters show room for further efficiency increase. Furthermore a new module concept for back-contact cells is presented where the metallization on cell level is point-shaped. The lateral conductance of collected carriers is enabled on module level by a structured printed circuit board. On the contacts an adhesive agent is screen-printed in order to make the aluminum contacts solderable. Afterwards a soldering paste is screen-printed which connects the cell and the printed circuit board or foil during a reflow process. This concept overcomes the restriction in cell size of back-contact back-junction modules due to thick copper layer.

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20%高效丝网印刷和铝合金背接触背结电池和点状金属化电池的互连方案

提出了一种采用丝网印刷技术进行结构和金属化的背接触背结硅太阳能电池。在n型基材上，采用局部印刷和合金化铝结构共烧形成发射极。通过测量光束感应电流(LBIC)，分析了不同的发射极覆盖范围对收集概率的影响，进而分析了短路电流密度的影响。效率高达20%，由弗劳恩霍夫ISE CalLab独立确认。对细胞结构进行了二维模拟，结果与处理后的细胞吻合较好。几个参数的变化显示出进一步提高效率的空间。在此基础上，提出了一种新的后接触电池模块概念，其中电池级的金属化是点状的。所收集的载流子的横向电导通过结构化印刷电路板在模块级上实现。在触点上丝网印刷粘合剂，以使铝触点可焊接。然后，在回流过程中，丝网印刷焊接膏，将电池和印刷电路板或箔连接起来。这一概念克服了背接触背结模块因铜层厚而对电池尺寸的限制。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2011 37th IEEE Photovoltaic Specialists Conference

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