Failure Analysis of Hermetic Sealing Process for a RF Module

Abstract

Hermetic package technique is employed broadly for the applications with high reliability requirements. The package procedure may induce several effects to thread the performance and reliability of the electronic devices. Meanwhile, radio frequency ICs are sensitive to the electrical stresses due to the high performance. As a result, all the steps of fabrication, package, transportation and assembling are considered for abnormal stresses. Failure analysis of hermetic sealing process for a RF module is investigated in this paper. With the analysis of schematic and hermetic parallel seam sealing process, the optimization method with shorting the hermetic plate and the ground pads is proposed and evaluated. The product yield is improved notably, and also the performance of the module can be optimized with the shielding effect.