Power integrity challenges of re-designing a mobile SoC with fully integrated voltage regulator to IoT applications

Abstract

The demand for connected smart cars has grown exponentially in the past few years. To meet consumer's digital lifestyle needs and take part in this emerging market, microprocessor companies, such as Intel®, are shifting a focus to automotive SoC package designs. This paper examines the differences in design specifications between automotive and mobile and the implications to Power Integrity. The automotive use case, temperature cycling, and reliability qualifications are more stringent and add to the Power Integrity challenges. Frequency and time domain simulations were performed for all Fully Integrated Voltage Regulator (FIVR) and non-FIVR rails and compared between automotive vs. mobile.