RF characterization of deep-submicron DRAM-embedded CMOS process

Seong-Ho Park, G. Lim, Yong-Hee Lee
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引用次数: 1

Abstract

In this paper rf characteristics of a 0.25 /spl mu/m DRAM embedded CMOS process, focused on the n-MOSFET and the spiral inductor of the critical devices in rf CMOS circuit design, have been investigated. An extremely high cutoff frequency of 44 GHz, high maximum operating frequency of 29 GHz, and a de-embedded minimum noise figure of 1.0 dB have been obtained for a 0.24 /spl mu/m n-MOSFET. As for the spiral inductors, we obtained a peak quality factor of 5.2 at 3.6 nH for a 5-turn inductor and also an inductance of 1.2 to 22.6 nH for inductors with various numbers of turns. These figures of merit seem to be suitable for rf circuits with operating frequency up to 2.5 GHz although the low quality factor of the spiral inductor should be improved.
深亚微米dram嵌入式CMOS工艺的射频特性
本文对0.25 /spl mu/m DRAM嵌入式CMOS工艺的射频特性进行了研究,重点研究了射频CMOS电路设计中的关键器件n-MOSFET和螺旋电感。在0.24 /spl mu/m n-MOSFET上获得了44 GHz的极高截止频率、29 GHz的最高工作频率和1.0 dB的去嵌入最小噪声系数。对于螺旋电感,我们获得了5匝电感在3.6 nH时的峰值品质因子5.2,对于不同匝数的电感,我们也获得了1.2至22.6 nH的电感。尽管螺旋电感的低质量因素有待改进,但这些优点似乎适用于工作频率高达2.5 GHz的射频电路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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