New patternable dielectric and optical materials for MCM-L/D- and o/e-MCM-packaging

Abstract

Photopatternable inorganic-organic copolymers (ormocers, or organically modified ceramics) with negative resist behaviour have been developed and tested as thin film materials for electrical and/or optical packaging purposes, e.g. MCM-L/D and optoelectronic MCM packaging. Good processability in combination with a much lower post-curing temperature (120/spl deg/C-170/spl deg/C) than alternative materials such as polyimide and benzocyclobutene enables the use of low cost glass fiber reinforced polymer substrates such as FR-4 and BT. The good electrical, optical and other properties are presented and discussed. The process and tentative design-rules for multilayer MCM-L/Ds are described and some test-vehicles are presented, emphasizing the versatility and low-cost potential of the new materials.