Steady-State Thermal Analysis on a Real-Time Plasma Impedance Tuner for High-Power RF Matching Applications

Justin Roessler, A. Fisher, Austin Egbert, Trevor Van Hoosier, C. Baylis, D. Peroulis, R. Marks
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Abstract

With fifth generation (5G) wireless spectrum reallocation presenting an increasingly congested spectral environment, radar systems need to utilize the advantages of real-time high-power impedance tuners to reconfigure in real time for maximization of output power and detection range. The ability to analyze a low-loss plasma switched-network impedance tuner, previously demonstrated for high-power capability, is further developed for analysis of thermal failure. The goal is both to understand the thermal properties and limitations of the radio-frequency (RF) board of the tuner under impedance tuning conditions and to assess the thermal power handling capabilities of the tuner structure. Based on thermal failure, an approach for assessing power-handling capability is demonstrated using CST's 3-D Multiphysics solver for Electromagnetic (EM)-Thermal Coupled simulations. The EM simulator analyzes the current density across the structure and translates this current density into temperature through the electrothermal model. The thermal analysis shows at least 51.1 W of power handling over all tuner states and frequencies, given failure by solder reflow at 91.5°C. The results of this paper provide a framework for analysis of tuner thermal failure and assessment of power handling.
大功率射频匹配实时等离子体阻抗调谐器的稳态热分析
随着第五代(5G)无线频谱重新分配呈现出日益拥挤的频谱环境,雷达系统需要利用实时高功率阻抗调谐器的优势进行实时重新配置,以最大化输出功率和检测范围。分析低损耗等离子体开关网络阻抗调谐器的能力,先前证明了高功率能力,将进一步开发用于热失效分析。目的是了解调谐器在阻抗调谐条件下的热特性和射频(RF)板的局限性,并评估调谐器结构的热功率处理能力。基于热失效,利用CST的电磁(EM)-热耦合仿真三维多物理场求解器演示了一种评估功率处理能力的方法。EM模拟器分析整个结构的电流密度,并通过电热模型将该电流密度转换为温度。热分析显示,在所有调谐器状态和频率下,如果在91.5°C下焊料回流导致故障,则至少有51.1 W的功率处理。本文的研究结果为调谐器热失效分析和功率处理评估提供了一个框架。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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