Stress Intensity Factors for Cracks Within and Near to Bondlines in Soft Incompressible Materials

C. Smith, K. Gloss, D. Constantinescu, C. Liu
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引用次数: 1

Abstract

Using a polyurethane photoelastic material, thick test specimens of several configurations with bonded end tabs are examined for measuring stress intensity factors (SIFs) for cracks within and near to bondlines in bonded photoelastic models. Effects of specimen height, glued end tabs, bondline and crack size and location are studied and analyzed using a two parameter model for extracting the SIFs and results are compared with cracked, homogeneous model results.
软质不可压缩材料粘结线内及粘结线附近裂纹的应力强度因子
使用一种聚氨酯光弹性材料,对几种配置的厚试件进行了检查,以测量粘接光弹性模型中粘接线内部和附近裂纹的应力强度因子(SIFs)。采用双参数模型提取SIFs,研究分析了试件高度、粘接端片、粘结线以及裂纹尺寸和位置等因素对SIFs的影响,并与均匀裂纹模型结果进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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