Transient Temperature Prediction for Aging Thermal Sensors Using Artificial Neural Network

Kameswar Rao Vaddina, J. M. Cebrian, L. Natvig
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引用次数: 3

Abstract

As technology scales down and power density increases, the temperature sensor characteristics will drift, leading to temperature errors which increase over time. Transistor aging is one of the leading contributors to temperature sensing inaccuracies. The prominent aging failure mechanisms like Negative Bias Temperature Instability (NBTI), Hot Carrier Injection (HCI) and electromigration have emerged as the main sources of system unreliability which manifest as an increase in the propagation delay over time. On-chip thermal sensors are not immune to this phenomenon and get affected by these aging mechanisms. Thermal sensor aging exacerbated by increased temperatures leads to temperature sensing inaccuracies requiring repeated sensor calibration. In this work, we propose a novel approach of using performance metrics to predict the transient temperature profile of an application as seen by the aging thermal sensor. Firstly, we make offline profiling of applications and then cluster them into groups using k-means clustering mechanism. Then we use a neural network model to predict the thermal profile of a new application given its performance metrics. The forecasting ability of our model is accessed using MSE and RMSE. This approach is highly scalable and can be used to predict future temperatures which can then be used for run-time dynamic thermal management of multi-core systems.
基于人工神经网络的老化热传感器瞬态温度预测
随着技术的缩小和功率密度的增加,温度传感器的特性会漂移,导致温度误差随着时间的推移而增加。晶体管老化是温度传感不准确的主要原因之一。负偏置温度不稳定性(NBTI)、热载流子注入(HCI)和电迁移等老化失效机制已成为系统不可靠性的主要来源,其表现为传输延迟随时间的增加。片上热传感器也不能幸免于这种现象,并受到这些老化机制的影响。温度升高加剧了热传感器的老化,导致温度传感不准确,需要反复校准传感器。在这项工作中,我们提出了一种使用性能指标来预测老化热传感器所看到的应用程序的瞬态温度分布的新方法。首先,我们对应用程序进行离线分析,然后使用k-means聚类机制将其聚类成组。然后,我们使用神经网络模型来预测给定性能指标的新应用程序的热分布。通过MSE和RMSE对模型的预测能力进行评价。该方法具有高度可扩展性,可用于预测未来温度,然后可用于多核系统的运行时动态热管理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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