{"title":"Effects Of Bulk And MOCVD Thin Film Cover On The Characteristics Of Microstrip Resonators","authors":"K. Joshi, R. Pollard, V. Postoyalko","doi":"10.1109/SBMO.1993.587251","DOIUrl":null,"url":null,"abstract":"Shift in the resonance frequency and an increase in the Q factor of microstrip resonators in the presence of dielectric cover are observed in the frequency range of 2- 26GHz. Various microwave materials are used as a dielectric cover which include bulk alumina, semi-insulating GaAs, RT-Duroid and MOCVD A1203 thin film. Increase in the Q factor is found to vary between 103% to 769% depending upon the cover permittivity and thickness. A process has been proposed to fabricate mu1 tilayer homogeineous microstrip using thin film alumina as a cover material giving rise to increase in the quality factor by 137% to 259 % .","PeriodicalId":219944,"journal":{"name":"SBMO International Microwave Conference/Brazil,","volume":"206 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"SBMO International Microwave Conference/Brazil,","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SBMO.1993.587251","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Shift in the resonance frequency and an increase in the Q factor of microstrip resonators in the presence of dielectric cover are observed in the frequency range of 2- 26GHz. Various microwave materials are used as a dielectric cover which include bulk alumina, semi-insulating GaAs, RT-Duroid and MOCVD A1203 thin film. Increase in the Q factor is found to vary between 103% to 769% depending upon the cover permittivity and thickness. A process has been proposed to fabricate mu1 tilayer homogeineous microstrip using thin film alumina as a cover material giving rise to increase in the quality factor by 137% to 259 % .