Thermal Analysis and Design of GaN Device of Energy Storage Converter Based on Icepak

Abstract

In order to optimize the heat dissipation capability of power devices attached to Printed circuit board (PCB), thermal vias are usually added to the PCB and heatsink are added on the back side. The idea of equal-area split vias filling is used to optimize the vias arrangement pattern, and the calculation formula of thermal resistance of PCB thermal vias unit is derived. The influence of the diameter of thermal vias, copper plating thickness, filling material and vias spacing on thermal resistance is studied by theoretical calculation formula. The thermal model is simulated using Icepak to compare the effects of the presence or absence of thermal vias on the PCB and the presence or absence of a heatsink on the temperature of the power devices. Finally, the correctness of the theoretical analysis is verified by comparing the theoretical analysis with the simulation results.