Circuit model of a thermoelectric module for ac electrical measurements

A. Downey, T. Hogan
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引用次数: 8

Abstract

Measurements of assembled thermoelectric modules commonly include investigations of the module output power versus load resistance. Such measurements include non-ideal effects such as electrical and thermal contact resistances. Using an AC electrical measurement, a model for a thermoelectric module has been developed utilizing electrical circuits for both the thermal and electrical characteristics of the module. Measurements were taken over the frequency range of 1mHz to 500Hz using lock-in amplifiers. We present data showing the extraction of ZT from such measurements on commercially available modules. By knowing either the heat capacity of the module or the average module Seebeck coefficient, determination of the thermal conductance can also be achieved. The model proposed here provides a simple equivalent circuit which can be analyzed using an electrical simulator such as SPICE. This model makes use of the magnitude and phase of the electrical impedance measured by the lock-in amplifiers at the input terminals of the module and includes fitting parameters of the total electrical resistance, thermal conductance, heat capacitance, and module Seebeck coefficient.
交流电测量用热电模块的电路模型
组装热电模块的测量通常包括对模块输出功率与负载电阻的研究。这些测量包括非理想的影响,如电和热接触电阻。利用交流电测量,开发了热电模块的模型,该模型利用了模块的热电特性的电路。使用锁相放大器在1mHz至500Hz的频率范围内进行测量。我们提供的数据显示,从商业上可用的模块上的这种测量中提取ZT。通过知道模块的热容或模块的平均塞贝克系数,也可以确定导热系数。本文提出的模型提供了一个简单的等效电路,可以使用SPICE等电子模拟器进行分析。该模型利用模块输入端锁相放大器测量的电阻抗的幅值和相位,包括总电阻、热导、热容和模块塞贝克系数的拟合参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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