The bandwidth benefits of close-to-chip lumped element matching of microwave high power amplifiers

Abstract

The bandwidth benefits of Close-to-Chip matching using lumped elements within the transistor encapsulation compared with Off-Chip matching using distributed elements outside the transistor encapsulation for high power microwave transistors have been simulated at 2 GHz. Simulation results indicate that Close-to-Chip matching using lumped elements gives a wider bandwidth compared with conventional Off-Chip matching using distributed elements.