Design rules to control the tensile strain in Ge μ-membranes fabricated from GeOI substrates for photonics applications

G. O. Dias, D. Rouchon, J. Widiez, J. Hartmann, D. Fowler, A. Chelnokov, V. Reboud, A. Gassenq, S. Tardif, K. Guiloy, N. Pauc, J. Escalante, I. Duchemin, Y. Niquet, F. Rieutord, V. Calvo, J. Faist, R. Geiger, T. Zabel, H. Sigg
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引用次数: 1

Abstract

Applying the right tensile strain to suspended membranes [1] can make Germanium a direct band-gap semiconductor, which is most promising way to low-threshold lasing [2]. The current key to reach the targeted high tensile strain is the quality of the Germanium. Epitaxied Germanium (Ge) on Silicon (Si) suffers from dislocations at its interface due to the lattice mismatch between Si and Ge (Figure 1 a). Higher crystalline quality can be obtained by fabricating Germanium on Insulator (GeOI) substrates by Smart Cut™ technology [3]. However, the processing has to be adapted to obtain specific “optical” GeOI substrates [4], much thicker than standard microelectronics GeOI.
光电用gei基板制备的Ge μ膜的拉伸应变控制规则
在悬浮膜上施加适当的拉伸应变[1]可以使锗成为直接带隙半导体,这是低阈值激光最有希望的方式[2]。目前达到目标高拉伸应变的关键是锗的质量。由于Si和Ge之间的晶格不匹配,硅(Si)上的外延锗(Ge)在其界面处存在位错(图1a)。通过Smart Cut™技术在绝缘体(GeOI)衬底上制造锗可以获得更高的晶体质量[3]。然而,加工必须适应以获得特定的“光学”GeOI衬底[4],比标准微电子GeOI厚得多。
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