Survey and taxonomy of three-dimensional packaging approaches

Abstract

This paper presents a survey of the field of 3-D packaging and suggests a taxonomy based on observations of an active research field and direct experience in the development of dimensionally-constrained electronics system packaging concepts. Of chief interest is the (1) identification of the attributes of 3-D approaches and quantitative performance metrics; (2) packaging medium and facilitation (e.g. thermal, mechanical, and electrical access) requirements; and the manifestation of certain regimes in 3-D packaging (e.g., "few-layers" vs. "many-layers"). The development of the taxonomy is further motivated by the discussion of 3-D heterogeneous packaging approaches as an ideal framework for packaging and interconnecting complex mixtures of analog, digital, sensor, microwave, and power management functional elements.