Design optimization of 16-nm bulk FinFET technology via geometric programming

P. Su, Yiming Li
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引用次数: 4

Abstract

Design rule is an important interface between design and manufacturing. It becomes more complex as the process advances to 16-nm and beyond. Current approaches to generate design rules are empirical shrink and lithographic simulation. However, it is time-consuming and costly to revise design rules for performance boost and yield improvement after design rules are frozen. Early performance gains in early design rule development without cost increase and yield loss will benefit semiconductor industry. In this work, we for the first time consider 16-nm bulk FinFET standard cell performance, yield, area, and layout style simultaneously to optimize design rules to meet ITRS by using geometric programming. Optical proximity correction, and electromagnetic field and circuit simulations are performed for objective function evaluation. The result achieves more than 100%-delay and 50%-yield improvement without area change by this systematic and statistical approach.
基于几何规划的16nm块体FinFET技术设计优化
设计规则是设计与制造之间的重要接口。随着工艺发展到16纳米及以上,它变得更加复杂。目前生成设计规则的方法是经验收缩和光刻模拟。然而,在设计规则被冻结后,为了提高性能和良率而修改设计规则是费时且昂贵的。在不增加成本和产量损失的情况下,早期设计规则开发的早期性能提升将有利于半导体行业。在这项工作中,我们首次同时考虑16nm块体FinFET标准电池的性能、良率、面积和布局风格,通过几何规划来优化设计规则以满足ITRS。对目标函数进行了光学接近校正、电磁场和电路仿真。通过系统的统计方法,在不改变面积的情况下,实现了100%以上的延迟和50%以上的成品率提高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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