Promising Micro-Nano-Technologies and Materials for Joining Precision Parts of Optics-and-Electronics Devices

Abstract

The investigations have shown the following promising tendencies in technologies for joining materials used in precision techniques: Removal of the damaged surface layer by chemical etching the joined surfaces allows, up to 6-fold enhancing both durability of part and glue conjunction between it. To modify properties of silicon-organic epoxy glue not only near the surface of combined parts but over the whole thickness of the glue joint, offered have been glue compositions based on thermo stable silicon-organic glue with embedded in it filler in the form of powder consisting of nano-dimensional (15 to 20 nm) particles of zirconium oxide in the amount up to 20 mass. %. The developed diamond-glue composition enables to shorten the duration of cooling the glue conjunction leucosapphire-copper to cryogenic temperature (from the room one down to 80 K) by 1.5 times and obtain the 6-fold increased durability, as well as higher reliability and longevity under thermal shocks. This composition is also recommended to provide efficient and uniform heat removal in solar panels. Deposition of the chromium vacuum coating with the thickness 50 to 100 nm modifies the Teflon surface and allows using the traditional glues for joining the parts processed in this way.