Microbeam mapping of single event latchups and single event upsets in CMOS SRAMs

J. Barak, E. Adler, B. Fischer, M. Schlogl, S. Metzger
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引用次数: 19

Abstract

The first simultaneous microbeam mapping of single event upset (SEU) and latchup (SEL) in the CMOS RAM HR165162 is presented. We found that the shapes of the sensitive areas depend on V/sub DD/, on the ions being used and on the site on the chip being hit by the ion. In particular, we found SEL sensitive sites close to the main power supply lines between the memory-bit-arrays by detecting the accompanying current surge. All these SELs were also accompanied by bit-flips elsewhere in the memory (which we call "indirect" SEUs in contrast to the well known SEUs induced in the hit memory cell only). When identical SEL sensitive sites were hit farther away from the supply lines only indirect SEL sensitive sites could be detected. We interpret these events as "latent" latchups in contrast to the "classical" ones detected by their induced current surge. These latent SELs were probably decoupled from the main supply lines by the high resistivity of the local supply lines.
CMOS sram中单事件锁存器和单事件扰动的微光束映射
首次在CMOS RAM HR165162中实现了单事件扰动(SEU)和闭锁(SEL)的同步微光束映射。我们发现敏感区域的形状取决于V/sub / DD/,取决于所使用的离子和被离子击中的芯片上的位置。特别是,通过检测伴随的浪涌电流,我们发现了靠近存储位阵列之间主电源线路的SEL敏感点。所有这些sel还伴随着内存中其他地方的位翻转(我们称之为“间接”seu,与仅在hit memory cell中诱导的seu相反)。当相同的SEL敏感点在远离供应线的地方被击中时,只能检测到间接的SEL敏感点。我们将这些事件解释为“潜在的”锁存,而不是由它们的感应电流浪涌检测到的“经典”锁存。这些潜在的sel可能是由于局部供电线路的高电阻率而与主供电线路分离的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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