Numerical Modelling of Vapor Dynamics in Vacuum Arcs between Electrodes with Metal Shield Wall using Moving Particle Method

T. Miyazaki, Yasunori Tanaka, Y. Nakano, Y. Uesugi, T. Ishijima, Gaku Asanuma, T. Onchi
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引用次数: 2

Abstract

This paper describes calculation results on copper vapor dynamics in reduced pressure arcs between the copper electrodes with and without a metal shield wall surrounding. Such a reduced pressure arc can be seen during high current interruption between the electrodes in vacuum circuit breakers (VCBs). This arc plasma is established from metal vapor itself from the electrodes. We have originally developed a numerical model for vapor behavior in reduced pressure arcs on the basis of a hybrid method: vapor dynamics including ions and neutral atoms were simulated in low pressure using the particle method of moving particle semi-implicit (MPS) method, whereas the finite volume method (FVM) was used to simulate electron temperature and electro-magnetic fields. The arc behavior is well known to be influenced by vapor dynamics and also the presence of the metal shield wall. Influence of the presence of metal shield wall was here studied on the vapor dynamics, the heavy particle temperatures and the ionization degrees. Calculation results showed that copper vapor was more concentrated around the center of the electrode axis because of the reflection of particles by the wall. Ionization degree was also decreased due to the vapor neutralization.
金属屏蔽壁真空电弧中蒸汽动力学的移动粒子法数值模拟
本文描述了铜电极间有和无金属屏蔽壁的减压弧中铜蒸气动力学的计算结果。这种减压弧可以在真空断路器(VCBs)中电极之间的大电流中断中看到。这种电弧等离子体是由来自电极的金属蒸气本身形成的。我们最初在混合方法的基础上开发了减压弧中蒸汽行为的数值模型:使用移动粒子半隐式(MPS)方法的粒子方法模拟低压下包括离子和中性原子的蒸汽动力学,而使用有限体积法(FVM)模拟电子温度和电磁场。电弧的行为是众所周知的影响蒸气动力学和存在的金属屏蔽壁。研究了金属屏蔽壁的存在对蒸汽动力学、重粒子温度和电离度的影响。计算结果表明,由于粒子被电极壁反射,铜蒸气更集中在电极轴中心附近。由于蒸汽中和作用,电离度降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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