{"title":"A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics : Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation Process","authors":"T. H. Yang, C. Y. Yang, A. Shigetou, C. Kao","doi":"10.23919/ICEP.2019.8733588","DOIUrl":null,"url":null,"abstract":"Joining of dissimilar materials is extremely important for flexible electronic packaging, that is generally achieved by assembly of pre-patterned electronic components with organic destination substrates in multi-layered architectures via transfer-printing technique. To avoid thermo-mechanical damages during bonding, organic- and inorganic-organic solid-state direct bonding must be achieved. Here we report a novel bonding process enabling both organic- and inorganic-organic material hybridization. Vacuum-induced reorganization of ethanol was used to achieve multiple effects of surface modification in this method, which has been named ethanol-assisted vacuum ultraviolet irradiation (E-VUV) process. In this study, investigation of X-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM) was conducted to thoroughly understand adhesion mechanism. The analytical results proved that the E-VUV process was applicable to PEEK-and tin-polyimide bonding, and the bonded interfaces are expected to be robust enough for flexible MEMS packaging.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733588","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Joining of dissimilar materials is extremely important for flexible electronic packaging, that is generally achieved by assembly of pre-patterned electronic components with organic destination substrates in multi-layered architectures via transfer-printing technique. To avoid thermo-mechanical damages during bonding, organic- and inorganic-organic solid-state direct bonding must be achieved. Here we report a novel bonding process enabling both organic- and inorganic-organic material hybridization. Vacuum-induced reorganization of ethanol was used to achieve multiple effects of surface modification in this method, which has been named ethanol-assisted vacuum ultraviolet irradiation (E-VUV) process. In this study, investigation of X-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM) was conducted to thoroughly understand adhesion mechanism. The analytical results proved that the E-VUV process was applicable to PEEK-and tin-polyimide bonding, and the bonded interfaces are expected to be robust enough for flexible MEMS packaging.