Virtual simulation method of interrelated physical processes in on-board electronic means

Y. Kofanov, S. Y. Sotnikova
{"title":"Virtual simulation method of interrelated physical processes in on-board electronic means","authors":"Y. Kofanov, S. Y. Sotnikova","doi":"10.1109/ITMQIS.2017.8085799","DOIUrl":null,"url":null,"abstract":"Virtual simulation method is developed in the work. It based on virtual 3D-models of the structures of on-board electronic means designs with superimposed heterogeneous fields of electrical, thermal, mechanical and other processes caused by united impacts of external factors. A distinctive feature of this method is the account of the close relationship of the flowing physical processes between themselves during the simulation.","PeriodicalId":231514,"journal":{"name":"2017 International Conference \"Quality Management,Transport and Information Security, Information Technologies\" (IT&QM&IS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 International Conference \"Quality Management,Transport and Information Security, Information Technologies\" (IT&QM&IS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITMQIS.2017.8085799","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

Virtual simulation method is developed in the work. It based on virtual 3D-models of the structures of on-board electronic means designs with superimposed heterogeneous fields of electrical, thermal, mechanical and other processes caused by united impacts of external factors. A distinctive feature of this method is the account of the close relationship of the flowing physical processes between themselves during the simulation.
机载电子设备中相关物理过程的虚拟仿真方法
在工作中发展了虚拟仿真方法。它是基于虚拟三维模型的机载电子装置结构设计,在外部因素共同影响下产生叠加的电、热、机械等过程的异质场。该方法的一个显著特点是在模拟过程中考虑了流动物理过程之间的密切关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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