MC/DD study of metal grain induced current variability in a nanoscale InGaAs FinFET

N. Seoane, M. Aldegunde, K. Kalna, A. García-Loureiro
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引用次数: 2

Abstract

The on- and off-current variability due to TiN metal grain workfunction fluctuations in a 10.4 nm gate length In0.53Ga0.47As FinFET is analysed using two in-house simulation tools based on the finite element method: a 3D Drift-Diffusion device simulator and a 3D ensemble Monte Carlo simulator, that include quantum-corrections through the density gradient approach. The Id-Vg characteristics have been compared in the sub-threshold region against ballistic NEGF simulations, showing an excellent agreement. Monte Carlo simulations, considering a 〈100〉 channel orientation, show a larger on-current variability, over a 120% increase, compared with the results from Drift-Diffusion simulations. In this study, three different metal grain sizes (10, 7 and 5 nm) have been analysed. We have observed that the underestimation of the variability when using Drift-Diffusion simulations is increasing with a reduction in the grain size.
纳米InGaAs FinFET中金属晶粒诱导电流变异性的MC/DD研究
使用基于有限元方法的两种内部仿真工具:3D漂移扩散器件模拟器和3D集成蒙特卡罗模拟器,包括通过密度梯度方法进行量子校正,分析了10.4 nm栅长In0.53Ga0.47As FinFET中TiN金属颗粒工作函数波动引起的通、关电流变异性。在亚阈值区域将Id-Vg特性与弹道NEGF模拟进行了比较,结果表明两者非常吻合。蒙特卡罗模拟,考虑到< 100 >通道方向,显示出更大的电流变异性,与漂移扩散模拟的结果相比,增加了120%以上。在这项研究中,分析了三种不同的金属晶粒尺寸(10,7和5nm)。我们观察到,当使用漂移扩散模拟时,对可变性的低估随着晶粒尺寸的减小而增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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