Finite Element Analysis on Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Using Different Shearing Height

Abstract

Enhancing the reliability Ball grid array (BGA) is significant due major contribution as an interconnection in the electronic devices. Due to the compactness of the electronic devices, ball grid array (BGA) interconnection methods are utilized as passage to transmit power and signals within the electronic. However, the reliability of the BGA is very significant as it has a direct effect on the performance of the device. Ball shear test are utilized to evaluate the reliability and adhesion strength of the solder ball. Therefore, in this work, shear test on solder joint of Ball Grid Array (BGA) was with varied shear height were simulated. Ansys version 11 was utilized for the simulation. The reliability two types of solder ball material, Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu were compared. The simulation result showed that shear ram height has significant influence on the outcome of the shear test. The Sn-3.5Ag-0.7Cu solder ball exhibited higher stress when compared Sn-3.9Ag-0.6Cu solder ball.