W. Byun, Bong-Su Kim, Kwang-Seon Kim, K. Eun, Myung‐Sun Song, R. Kulke, O. Kersten, G. Mollenbeck, M. Rittweger
{"title":"Design of vertical transition for 40GHz transceiver module using LTCC technology","authors":"W. Byun, Bong-Su Kim, Kwang-Seon Kim, K. Eun, Myung‐Sun Song, R. Kulke, O. Kersten, G. Mollenbeck, M. Rittweger","doi":"10.1109/EMICC.2007.4412773","DOIUrl":null,"url":null,"abstract":"In this paper, we present design, implementation and measurement of 3D mm-wave LTCC (low temperature co-fired ceramic) module with vertical transition through FR-4 PCB substrate. A new structure in order to transfer mm-wave signal from transceiver module through an opening in FR-4 PCB substrate to antenna with standard WR-22 waveguide port is proposed. The module features front-end, receiver and transmitter. The opening in FR-4 PCB substrate is of rectangular type, which has the same dimensions as a WR-22 waveguide. The edge of the opening is conductively plated with copper from top side to the bottom to reduce transmission losses. The implemented module is compact in size (32 x 28 x 3.3 mm ). Experimental results show a 1dB compression output power of 15 dBm and noise figure of 9.72 dB at 40.5~41.5 GHz.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"57 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 European Microwave Integrated Circuit Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMICC.2007.4412773","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 15
Abstract
In this paper, we present design, implementation and measurement of 3D mm-wave LTCC (low temperature co-fired ceramic) module with vertical transition through FR-4 PCB substrate. A new structure in order to transfer mm-wave signal from transceiver module through an opening in FR-4 PCB substrate to antenna with standard WR-22 waveguide port is proposed. The module features front-end, receiver and transmitter. The opening in FR-4 PCB substrate is of rectangular type, which has the same dimensions as a WR-22 waveguide. The edge of the opening is conductively plated with copper from top side to the bottom to reduce transmission losses. The implemented module is compact in size (32 x 28 x 3.3 mm ). Experimental results show a 1dB compression output power of 15 dBm and noise figure of 9.72 dB at 40.5~41.5 GHz.