Thermal Rheological Behavior of Composite Interlayer in Laminated Glass

Dongdong Xie, Jian Yang, Xing-er Wang, Chenjun Zhao, Xian Jiang, Gang Li
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Abstract

Laminated glass is growing its application in structural entities. The thermoplastic polymeric interlayer plays an important role in transferring force and achieving the composite action in laminated glass, which reveals evident temperature-dependent behavior. In this study, a novel composite interlayer (SGE®) was devised to improve the resistance of laminated glass against environmental actions and to enhance the post-fracture performance. It is comprised of modified ethylene-vinyl-acetate (PVE®) and polycarbonate (PC). Through dynamic mechanical thermal analysis, the temperature-dependent characteristics of SGE, PVE, and PC materials were investigated in detail. The results show that the thermal rheological behavior of SGE is similar to that of PVE. The temperature ranges of glass transition and crystal melting of SGE material are -35°C ~ -25°C and 45°C ~ 75°C, respectively. The corresponding ranges are -35°C ~ -15°C and 35°C ~ 65°C for PVE material. And temperature ranges of the main transition are influenced by imposed frequency. Besides, the relationship between time and temperature for PVE, PC, and SGE material is extensively complicated and the complexity depends on the investigated mechanical property, temperature range, and time range. And the simple thermal rheological behavior emerges in the storage modulus of polymers, but loss modulus and loss factor conform to the complex thermal rheological behavior at the temperature range of -50°C ~ 120°C under the frequency range of 0.1 Hz ~ 10 Hz.
夹层玻璃中复合夹层的热流变行为
夹层玻璃在结构实体中的应用越来越广泛。热塑性聚合物夹层在夹层玻璃中起着传递力和实现复合作用的重要作用,表现出明显的温度依赖性。在这项研究中,一种新型的复合夹层(SGE®)被设计出来,以提高夹层玻璃对环境影响的抵抗力,并提高断裂后的性能。它由改性乙烯-乙烯-乙酸酯(PVE®)和聚碳酸酯(PC)组成。通过动态力学热分析,详细研究了SGE、PVE和PC材料的温度依赖特性。结果表明,SGE的热流变行为与PVE相似。SGE材料的玻璃化转变温度范围为-35℃~ -25℃,晶体熔化温度范围为45℃~ 75℃。PVE材料对应的温度范围为-35℃~ -15℃,35℃~ 65℃。主转变温度范围受施加频率的影响。此外,PVE、PC和SGE材料的时间和温度之间的关系非常复杂,其复杂性取决于所研究的力学性能、温度范围和时间范围。在-50°C ~ 120°C的温度范围内,在0.1 Hz ~ 10 Hz的频率范围内,聚合物的存储模量表现为简单的热流变行为,而损耗模量和损耗因子则表现为复杂的热流变行为。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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