Performance analysis of doped multi-layer graphene nanoribbon (MLGNR) interconnects at deep sub-micron nodes

Farhana Khurshid, Amandeep Sharma
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Abstract

With technology, shrinking towards deep sub-micron Multi-layer GNR (Graphene Nanoribbons) has become evolving choice for the use of interconnects, as technology is moving towards deep submicron dimensions. This is due to the various superior capabilities, which includes large current carrying capacity, very high conductivity and strength. The performance of doped multilayer GNR is far better than neutral GNR for global line. It has been seen Fermi energy increases with suitable addition of dopant atoms. Therefore, doping has a direct impact on Fermi energy and can cause reduction in parasitic components present in interconnects. Dependence of propagation delay and Power Delay Product (PDP) on Fermi energy is analyzed. With insertion of suitable repeaters, the performance of doped multi-layer graphene nanoribbon is studied for varying technology nodes. It is observed that doped multilayer MLGNR with proper Fermi energy at global lengths can outperform and replace copper interconnects.
深亚微米节点掺杂多层石墨烯纳米带(MLGNR)互连性能分析
随着技术向深亚微米方向发展,多层GNR(石墨烯纳米带)已成为互连使用的不断发展的选择。这是由于各种优越的能力,其中包括大的载流能力,非常高的导电性和强度。对于全局线,掺杂多层GNR的性能远远优于中性GNR。结果表明,适当添加掺杂原子可使费米能增加。因此,掺杂对费米能量有直接影响,并且可以导致互连中寄生成分的减少。分析了传输延迟和功率延迟积(PDP)与费米能量的关系。通过插入合适的中继器,研究了掺杂多层石墨烯纳米带在不同技术节点下的性能。研究发现,在全局长度上具有适当费米能量的掺杂多层MLGNR可以取代铜互连。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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