Performance Analysis of Squarely Packed Dimorphic MWCNT Bundle for High Speed VLSI Interconnect

Abstract

According to the demand of present era, carbon nanotubes are getting closer attention as VLSI high speed interconnects. This consequence drives us to conduct our research on the performance evaluation of different configurations of MWCNT bundle as interconnect based on the propagation delay estimation. Throughout this paper, we are going to propose our own configuration model, named Squarely packed Dimorphic MWCNT, develop mathematical model for different circuit elements i.e. Resistance, Capacitance and Inductance. Finally, we are going to put a decision regarding the configuration with better performance by simulating different configuration and different interconnect material using MATLAB.