Intermittent faults and effects on reliability of integrated circuits

C. Constantinescu
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引用次数: 94

Abstract

A significant amount of research has been aimed at analyzing the effects of high energy particles on semiconductor devices. However, less attention has been given to the intermittent faults. Field collected data and failure analysis results presented in this paper clearly show intermittent faults are a major source of errors in modern integrated circuits. The root cause for these faults ranges from manufacturing residuals to oxide breakdown. Burstiness and high error rates are specific manifestations of the intermittent faults. They may be activated and deactivated by voltage, frequency, and operating temperature variations. The aggressive scaling of semiconductor devices and the higher circuit complexity are expected to increase the likelihood of occurrence of the intermittent faults, despite the extensive use of fault avoidance techniques. Herein we discuss the effectiveness of several fault tolerant approaches, taking into consideration the specifics of the errors generated by intermittent faults. Several solutions, previously proposed for handling particle induced soft errors, are exclusively based on software and too slow for handling large bursts of errors. As a result, hardware implemented fault tolerant techniques, such as error detecting and correcting codes, self checking, and hardware implemented instruction retry, are necessary for mitigating the impact of the intermittent faults, both in the case of microprocessors, and other complex integrated circuits.
间歇性故障及其对集成电路可靠性的影响
大量的研究旨在分析高能粒子对半导体器件的影响。然而,对间歇性故障的关注较少。现场采集的数据和本文给出的故障分析结果清楚地表明,间歇性故障是现代集成电路的主要故障来源。这些故障的根本原因包括从制造残留物到氧化物分解。突发性和高错误率是间歇性故障的具体表现。它们可以通过电压、频率和工作温度的变化来激活和停用。尽管广泛使用了故障避免技术,但半导体器件的积极缩放和更高的电路复杂性预计会增加间歇性故障发生的可能性。在此,我们讨论了几种容错方法的有效性,并考虑了间歇性故障产生的错误的具体情况。以前提出的处理粒子引起的软错误的几种解决方案完全基于软件,并且对于处理大的错误突发来说太慢。因此,在微处理器和其他复杂集成电路的情况下,硬件实现的容错技术(如错误检测和纠错代码、自检和硬件实现的指令重试)对于减轻间歇性故障的影响是必要的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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