Effect of Doped AlGaN Width Variation on Analog Performance of Dual Gate Underlap MOS-HEMT

A. Mondal, Sneha Ghosh, Akash Roy, M. Kar, A. Kundu
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Abstract

A Symmetric Heterojunction Underlap Double Gate (U-DG) GaN/AlGaN Metal Oxide Semiconductor High Electron Mobility Transistor (MOS-HEMT) having negatively doped AlGaN region and AlGaN spacer has been studied for varying values of doped AlGaN width in this work. This paper shows a detailed performance analysis of the Analog Figure of Merits (FoMs) with varying doped width. The effect of doping on analog performances of the device has also been scrutinized. The Figure of Merits (FoMs) like variation of Drain Current (IDS) with Gate Voltage (VGS) and Drain Current with Drain Voltage (VDS), Transconductance (gm), Output Resistance (R0) and Intrinsic Gain (gmR0) have been under investigation alongside the consequences of altering the width of doped AlGaN layer. Conduction band diagrams for both ON and OFF states are used to explain the device behaviour. Studies show that by reducing the width of the doped region in the MOS-HEMT device, better gate controllability is obtained along with higher ON current.
掺杂AlGaN宽度变化对双栅搭接MOS-HEMT模拟性能的影响
本文研究了一种具有负掺杂AlGaN区域和AlGaN间隔层的对称异质结Underlap双栅(U-DG) GaN/AlGaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT)。本文对不同掺杂宽度的FoMs进行了详细的性能分析。研究了掺杂对器件模拟性能的影响。漏极电流(IDS)随栅极电压(VGS)和漏极电流随漏极电压(VDS)、跨导(gm)、输出电阻(R0)和本征增益(gmR0)的变化等优点图(FoMs)与改变掺杂AlGaN层宽度的后果一起被研究。导带图用于开和关状态来解释器件的行为。研究表明,减小MOS-HEMT器件中掺杂区的宽度,可以获得更好的栅极可控性和更高的导通电流。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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