Reliability Enhancement of Solution Processed Amorphous In-Zn-O Thin-Film Transistors via a Low Temperature (180 °C) Solution Processed Passivation

A. Syairah, J. Bermundo, Naofumi Yoshida, T. Nonaka, M. Fujii, Y. Ishikawa, Y. Uraoka
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Abstract

The interaction between ambient environment or the adsorption-desorption of oxygen and water molecules at the back channel of bottom gate amorphous InZnO (a-IZO) thin-film transistors (TFTs) is one of the biggest issues that greatly affects the performance and reliability of TFTs. The issue can be overcome by depositing a passivation at the back channel as a protection barrier. This paper presents the performance of solution processed a-IZO TFTs incorporated with different types of Polysilsesquioxane (PSQ) passivation layers fabricated at low temperatures of 180 °C. A clear reliability enhancement is observed by using the low temperature PSQ which reduced the very high threshold voltage shift ($V_{th}$) of 16.0 V after positive bias stress (PBS) of unpassivated a-IZO TFT to a low $V_{th}$ of 3.1 V after passivation.
通过低温(180°C)溶液钝化提高非晶In-Zn-O薄膜晶体管的可靠性
底栅非晶InZnO (a-IZO)薄膜晶体管(TFTs)后通道中氧和水分子的吸附-解吸是影响TFTs性能和可靠性的最大问题之一。这个问题可以通过在后通道沉积钝化层作为保护屏障来克服。本文研究了不同类型的聚硅氧烷(PSQ)钝化层在低温180°C下溶液处理的a-IZO tft的性能。通过低温PSQ,可将未钝化的A - izo TFT的正偏置应力(PBS)后的16.0 V的极高阈值电压移($V_{th}$)降低到钝化后的3.1 V的低阈值电压移($V_{th}$),从而明显提高了可靠性。
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