An optimized isolated 5V EDMOS in 55nm LPx platform for use in Power Amplifier applications

Ming Li, Shaoqiang Zhang, P. Shyam, Raj Verma Purakh
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引用次数: 1

Abstract

Power Amplifier (PA) modules are becoming more and more complex in modern wireless systems. In order to meet the efficiency/linearity design schemes such as Envelope elimination and restoration (EER) and Envelope tracking (ET) are increasingly becoming popular in PA applications. This paper describes an optimized isolated 5V EDMOS in 55nm Low Power extended (LPx) platform which is ideal for use in the bias modulator and controller of the PA module. Industry leading Rsp of 0.96 mohm-mm2 for high voltage NMOS and 2.6 mohm-mm2 for the high voltage PMOS is reported. Drain to source breakdown voltages of 10.5V was achieved for these devices. Due to special considerations given to optimizing the CGD capacitance while maintaining the Rsp, high Johnson's figure of merit (fT*BVDS) of 536 GHz-V and 168 GHz-V were achieved for the NMOS and PMOS respectively.
在55nm LPx平台上优化的隔离5V EDMOS,用于功率放大器应用
在现代无线系统中,功率放大器(PA)模块变得越来越复杂。为了满足效率/线性的要求,包络消除和恢复(EER)和包络跟踪(ET)等设计方案在PA应用中越来越受欢迎。本文介绍了一种在55nm低功耗扩展(LPx)平台上优化的隔离5V EDMOS,它非常适合用于PA模块的偏置调制器和控制器。据报道,高压NMOS的Rsp为0.96 mohm-mm2,高压PMOS的Rsp为2.6 mohm-mm2。这些器件的漏极到源极击穿电压达到10.5V。由于在保持Rsp的同时优化CGD电容的特殊考虑,NMOS和PMOS分别获得了536 GHz-V和168 GHz-V的高约翰逊优值(fT*BVDS)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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