High temperature migration of thick film conductor

T. Nagasaka, Y. Ootani, K. Oka, M. Miyairi, K. Naito
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Abstract

When burn-in testing was performed at high temperature with opposing electrodes which were formed on the thick film Ag conductor, a short occurred between the electrodes. We realized that this was due to the electric field strength in addition to the temperature. Moreover, we found the cause of this short from the results of our investigation: in the conductor firing process, Ag is melted with glass inside the conductor and this mixture of Ag and glass disperses and accumulates near the electrode. For this reason, we improved the glass quality inside the conductor to decrease the degree of dispersion of the Ag/glass mixture during firing of the conductor and avoided high temperature migration.
厚膜导体的高温迁移
当在厚膜银导体上形成相反的电极在高温下进行烧蚀测试时,电极之间会发生短路。我们意识到这是由于电场强度除了温度。此外,我们从调查结果中发现了造成这种短路的原因:在导体烧制过程中,Ag与导体内部的玻璃熔化,这种Ag和玻璃的混合物分散并积聚在电极附近。为此,我们改进了导体内部的玻璃质量,降低了导体烧制过程中Ag/玻璃混合物的分散程度,避免了高温迁移。
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