Wei Huang, M. Stan, K. Skadron, K. Sankaranarayanan, S. Ghosh, S. Velusamy
{"title":"Compact thermal modeling for temperature-aware design","authors":"Wei Huang, M. Stan, K. Skadron, K. Sankaranarayanan, S. Ghosh, S. Velusamy","doi":"10.1145/996566.996800","DOIUrl":null,"url":null,"abstract":"Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propose a compact thermal model which can be integrated with modern CAD tools to achieve a temperature-aware design methodology. Finally, we use the compact thermal model in a case study of microprocessor design to show the importance of using temperature as a guideline for the design. Results from our thermal model show that a temperature-aware design approach can provide more accurate estimations, and therefore better decisions and faster design convergence.","PeriodicalId":115059,"journal":{"name":"Proceedings. 41st Design Automation Conference, 2004.","volume":"236 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"348","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 41st Design Automation Conference, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/996566.996800","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 348
Abstract
Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propose a compact thermal model which can be integrated with modern CAD tools to achieve a temperature-aware design methodology. Finally, we use the compact thermal model in a case study of microprocessor design to show the importance of using temperature as a guideline for the design. Results from our thermal model show that a temperature-aware design approach can provide more accurate estimations, and therefore better decisions and faster design convergence.