Reduction of Stray Capacitance in an Inverter Main Circuit Using Multilayer Printed Circuit Boards

Kohsuke Ishikawa, S. Ogasawara, M. Takemoto, K. Orikawa
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Abstract

This paper deals with stray capacitance in an inverter main circuit on a printed circuit board (PCB), which affects switching characteristics in a voltage source inverter (VSI), and reduction of the stray capacitance. A simulation shows that switching speed is decreased by the stray capacitance on the inverter output electrode pattern. The design guidelines focusing on reduction of the stray capacitance are proposed. Further, based on the guidelines, a SiC-MOSFET VSI to reduce the stray capacitance is designed using a double-sided PCB with 35 μm-thick standard copper foil. Experiments using SiC- MOSFET VSIs show that the inverter with the redesigned PCB shortens the switching time of the drain-source voltage by 10% for the rise time and by 38% for the fall time compared with an inverter based on our previous design guidelines. Hence, the switching loss is also reduced using the redesigned PCB inverter.
利用多层印刷电路板降低逆变器主电路的杂散电容
本文研究了印制电路板上逆变器主电路中杂散电容对电压源逆变器开关特性的影响,以及如何减小杂散电容。仿真结果表明,逆变器输出电极图案上的杂散电容会降低开关速度。提出了以减小杂散电容为重点的设计准则。在此基础上,利用35 μm厚标准铜箔的双面PCB设计了减小杂散电容的SiC-MOSFET VSI。使用SiC- MOSFET vsi进行的实验表明,与基于先前设计指南的逆变器相比,采用重新设计的PCB的逆变器将漏源电压的开关时间缩短了10%的上升时间和38%的下降时间。因此,使用重新设计的PCB逆变器也降低了开关损耗。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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