Survey of non-destructive inspection methods for solder joint integrity

Proceedings of the IEEE 1991 National Aerospace and Electronics Conference NAECON 1991 Pub Date : 1991-05-20 DOI:10.1109/NAECON.1991.165925

D. O'Conchuir, J. Mccurdy, V. Casey

引用次数: 15

Abstract

Non-destructive techniques for solder joint inspection are surveyed. Both commercially available systems and methods still under research are described. The techniques are divided into visual, thermal, X-ray, and acoustic inspection. The mode of operation for each method is described and its good and bad points are looked at. It is seen that each method is suited to a particular inspection need, and no one technique fulfils all the requirements for a perfect system.<>

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焊点完整性无损检测方法综述

对焊点无损检测技术进行了研究。描述了商业上可用的系统和仍在研究中的方法。这些技术分为视觉、热、x射线和声学检查。描述了每种方法的操作模式，并对其优缺点进行了分析。可以看出，每种方法都适合于特定的检测需要，没有一种技术能够满足完美系统的所有要求

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the IEEE 1991 National Aerospace and Electronics Conference NAECON 1991

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