Modular Wideband 1–15 GHz Transmitter Channelizer for High Data Rate Communication

M. Eissa, A. Malignaggi, G. Panic, L. Lopacinski, R. Kraemer, D. Kissinger
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引用次数: 5

Abstract

This work presents a modular wideband transmitter channelizer for high data rate communication applications, manufactured in a 130 nm SiGe:C BiCMOS technology with fT / fmax= 300/500 GHz. Three independent I/Q baseband signals are upconverted to different intermediate frequencies and then bonded in current domain. A local oscillator leakage cancellation functionality is implemented on chip within the input stage to enhance the dynamic range. Single ended inputs were utilized in order to reduce the pin count, for a more practical realization and higher potential toward future system scaling. The transmitter channelizer achieves an output 3-dB bandwidth of 15 GHz. LO rejection of 74 dBc at the center frequency was measured after calibration. It dissipates 355 m Wand occupies 1.5 mm2. With these specifications the presented circuitry suits well as a practical solution for wideband channelization for high data rate transmission scenario's, such as THz and sub-THz communications applications, with a potential scaling-up to higher number of channels.
用于高数据速率通信的模块化宽带1 - 15ghz发射机信道器
这项工作提出了一种用于高数据速率通信应用的模块化宽带发射机信道器,采用130 nm SiGe:C BiCMOS技术制造,fT / fmax= 300/500 GHz。将三个独立的I/Q基带信号上转换为不同的中频,然后在电流域中进行键合。芯片在输入级内实现了本振漏损消除功能,提高了动态范围。使用单端输入是为了减少引脚数,以实现更实际的实现,并为未来的系统扩展提供更高的潜力。发射机信道转换器输出3db带宽为15ghz。校正后测量了中心频率处74 dBc的LO抑制。它的耗散为355 m,魔杖占地1.5 mm2。有了这些规范,所提出的电路很适合作为高数据速率传输场景的宽带信道化的实用解决方案,例如太赫兹和次太赫兹通信应用,具有潜在的扩展到更高数量的信道。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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