A framework for developing power electronics packaging

Abstract

As the integration of electro-physical circuits increases, many physical components and topologies are either directly or indirectly determined by the electrical designer. This paper presents a packaging technology framework for designers to better understand, evaluate and communicate the technical needs for a 'physical circuit'. The framework goes further in proposing a systematic method to link technical power packaging issues to user requirements as the basis for developing a power electronics technology roadmap. This paper presents the framework as a three-dimensional coordinate of user requirements, levels of packaging and interfaces and pathways, cross-cut by a fourth dimension of energy forms. Examples assist the reader in understanding the framework and appreciating the potential for application of the framework in the future developments of power electronics packaging.