Biofilm Remediation Using Cold Atmospheric Pressure Plasma Planar and Radial Arrays

M. Pearlman, M. Okebiorun, C. Waite, D. Miller, T. Koch, J. Escoba, J. Tenorio, D. Plumlee, K. Cornell, J. Browning
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Abstract

Cold Atmospheric-Pressure Plasma (CAP) planar and radial arrays have been developed to both inactivate and remove biofilms from surfaces [1] , [2] . The planar arrays are made from Low Temperature Co-fired Ceramic (LTCC), consisting of 8 linear discharge elements 2.4 cm long with a 0.75 mm gap between each element, and operate at 1-3 kV, 20 kHz AC. Typical gas flows use Ar at 13 SLM hydrated with water. Previous results show generation of hydrogen peroxide and hydroxyl radicals which increase linearly with plasma exposure times from the arrays and >99% Colony Forming Unit (CFU) reduction in <60 s for bacterial biofilms on a range of substrates (stainless steel, glass, plastic) [1] . Here we apply these arrays on a much larger surface area (10× 10 cm) by scanning the active array across a surface. The CFU count, chemical assays, and etch rates for this experiment will be presented. The radial arrays consist of four LTCC elements ≈3 cm in diameter with ≈0.75 cm gaps between each element. These radial arrays are designed for use in pipes. Imaging of biofilm removal is also under development.
低温常压等离子体平面和径向阵列修复生物膜
冷大气压等离子体(CAP)平面和径向阵列已被开发用于灭活和去除表面的生物膜[1],[2]。平面阵列由低温共烧陶瓷(LTCC)制成,由8个2.4 cm长的线性放电元件组成,每个元件之间的间隙为0.75 mm,工作在1-3 kV,交流20 kHz。典型的气体流使用13 SLM的氩气与水水合。先前的研究结果表明,过氧化氢和羟基自由基的产生随着等离子体暴露时间的增加而线性增加,并且在一系列底物(不锈钢,玻璃,塑料)上的细菌生物膜在<60 s内菌落形成单位(CFU)减少>99%[1]。在这里,我们通过扫描表面上的有源阵列,将这些阵列应用于更大的表面积(10× 10厘米)。本实验将介绍CFU计数、化学分析和蚀刻速率。径向阵列由4个直径≈3 cm的LTCC单元组成,每个单元之间的间距≈0.75 cm。这些径向阵列设计用于管道。生物膜去除成像也在发展中。
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