Novel test structure for evaluating dynamic dopant activation after ion implantation

J. Tsai, R. Chang, Cheng-Hui Chou, Hsueh-Chun Liao, S. Huang, Sung-Hung Lin, Jui-Chang Lin
{"title":"Novel test structure for evaluating dynamic dopant activation after ion implantation","authors":"J. Tsai, R. Chang, Cheng-Hui Chou, Hsueh-Chun Liao, S. Huang, Sung-Hung Lin, Jui-Chang Lin","doi":"10.1109/ICMTS.2016.7476200","DOIUrl":null,"url":null,"abstract":"This work focuses on the development of a novel test structure to evaluate the dynamic behavior of electrical characteristics in the boron-implanted germanium samples during the solid phase epitaxial regrowth (SPER) at low temperature annealing of 360 and 400 °C with various annealing times ranging from 30 to 300 min. In the early stage of SPER annealing, the sheet carrier concentration is increased with annealing time. And then, it will saturate to a level after about 2 hr annealing which implies the completion of SPER process.","PeriodicalId":344487,"journal":{"name":"2016 International Conference on Microelectronic Test Structures (ICMTS)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 International Conference on Microelectronic Test Structures (ICMTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.2016.7476200","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

This work focuses on the development of a novel test structure to evaluate the dynamic behavior of electrical characteristics in the boron-implanted germanium samples during the solid phase epitaxial regrowth (SPER) at low temperature annealing of 360 and 400 °C with various annealing times ranging from 30 to 300 min. In the early stage of SPER annealing, the sheet carrier concentration is increased with annealing time. And then, it will saturate to a level after about 2 hr annealing which implies the completion of SPER process.
评价离子注入后动态掺杂激活的新型测试结构
本工作的重点是开发一种新的测试结构,以评估硼注入锗样品在360°和400°C低温退火和30至300 min不同退火时间下固相外延再生(SPER)过程中的电特性动态行为。在SPER退火的早期阶段,片载流子浓度随着退火时间的增加而增加。然后,经过2小时左右的退火,它将饱和到一个水平,这意味着SPER过程的完成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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