J. Ku, C.-J. Choi, S. Song, S. Choi, K. Fujihara, H. Kang, S.I. Lee, H.-G. Choi, D. Ko
{"title":"High performance pMOSFETs with Ni(Si/sub x/Ge/sub 1-x/)/poly-Si/sub 0.8/Ge/sub 0.2/ gate","authors":"J. Ku, C.-J. Choi, S. Song, S. Choi, K. Fujihara, H. Kang, S.I. Lee, H.-G. Choi, D. Ko","doi":"10.1109/VLSIT.2000.852791","DOIUrl":null,"url":null,"abstract":"For the first time, Ni salicide process is applied directly on poly-Si/sub 0.8/Ge/sub 0.2/ gate, and pMOSFETs utilizing Ni(Si/sub x/Ge/sub 1-x/)/poly-Si/sub 0.8/Ge/sub 0.2/ gate are fully characterized. The excellent value (/spl sim/5/spl Omega///spl square/) of sheet resistance is achieved from 0.15 /spl mu/m Ni(Si/sub x/Ge/sub 1-x/)/Si/sub 0.8/Ge/sub 0.2/ gate, while Co salicide process applied on Si/sub 0.8/Ge/sub 0.2/ gate results in R/sub s/ fail due to Ge segregation. It is also important to note that, with poly-Si/sub 0.8/Ge/sub 0.2/ gate and Ni salicide process, the current drivability of pMOSFETs is significantly improved due to less gate poly depletion and lower source-to-drain resistance (R/sub sd/). Conclusively, Ni salicide is the exclusive process for successful germanosilicide formation on poly-Si/sub 0.8/Ge/sub 0.2/ gate without poly-Si buffer layer and Ni(Si/sub x/Ge/sub 1-x/)/poly-Si/sub 0.8/Ge/sub 0.2/ gate can increase L/sub dsat/ of pMOSFETs by 20% as compared to conventional CoSi/sub 2//poly-Si gate structure.","PeriodicalId":268624,"journal":{"name":"2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2000.852791","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
For the first time, Ni salicide process is applied directly on poly-Si/sub 0.8/Ge/sub 0.2/ gate, and pMOSFETs utilizing Ni(Si/sub x/Ge/sub 1-x/)/poly-Si/sub 0.8/Ge/sub 0.2/ gate are fully characterized. The excellent value (/spl sim/5/spl Omega///spl square/) of sheet resistance is achieved from 0.15 /spl mu/m Ni(Si/sub x/Ge/sub 1-x/)/Si/sub 0.8/Ge/sub 0.2/ gate, while Co salicide process applied on Si/sub 0.8/Ge/sub 0.2/ gate results in R/sub s/ fail due to Ge segregation. It is also important to note that, with poly-Si/sub 0.8/Ge/sub 0.2/ gate and Ni salicide process, the current drivability of pMOSFETs is significantly improved due to less gate poly depletion and lower source-to-drain resistance (R/sub sd/). Conclusively, Ni salicide is the exclusive process for successful germanosilicide formation on poly-Si/sub 0.8/Ge/sub 0.2/ gate without poly-Si buffer layer and Ni(Si/sub x/Ge/sub 1-x/)/poly-Si/sub 0.8/Ge/sub 0.2/ gate can increase L/sub dsat/ of pMOSFETs by 20% as compared to conventional CoSi/sub 2//poly-Si gate structure.