Correlation Technologies for OTA Testing of mmWave Mobile Devices Using Energy Metrics

S. Wane, T. Dinh, Quan Hung Tran, D. Bajon, F. Ferrero, L. Duvillaret, G. Gaborit, J. Sombrin, E. De Ledinghen, P. Laban, V. Huard, S. Mhira, L. Tombakdjian, P. Ratajczak, A. Bousseksou
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引用次数: 2

Abstract

In this paper, we introduce correlation technologies both at RF/mmWave and Base-Band frequencies. At RF and mmWave frequencies power-spectra and energy-spectra metrics are introduced for measuring the power-density of mobile devices and systems. The use of unified power-spectra and energy-spectra metrics leads to innovative Electromagnetic-Thermal sensing solutions for OTA-Testing. At Base-Band frequencies, DSP-based Convolutional-Accelerators are proposed for fast and accurate measurement of EVM (Error Vector Magnitude) using correlation technologies. New ASIC-embedded Smart-Connectors are developed for bringing correlation-based signal processing close to antenna-in-package (AiP) modules. Porting of the DSP-based Convolutional-Accelerators into advanced FD-SOI-ASIC platforms for co-integration with adaptive RF/mmWave FrontEnd-Modules will enable real-time extraction of auto-correlation and cross-correlation functions of stochastic signals for mobile devices and systems. Perspectives toward optically synchronized interferometric-correlation technologies are drawn for accurate measurements of stochastic EM fields in noisy environments.
基于能量度量的毫米波移动设备OTA测试相关技术
本文介绍了射频/毫米波和基带频率下的相关技术。在射频和毫米波频率下,引入了用于测量移动设备和系统功率密度的功率谱和能谱指标。使用统一的功率谱和能谱指标可以为ota测试提供创新的电磁热感测解决方案。在基带频率,提出了基于dsp的卷积加速器,利用相关技术快速准确地测量EVM(误差矢量幅度)。开发了新的asic嵌入式智能连接器,使基于相关的信号处理接近天线封装(AiP)模块。将基于dsp的卷积加速器移植到先进的FD-SOI-ASIC平台上,与自适应RF/毫米波前端模块进行协集成,将能够实时提取移动设备和系统随机信号的自相关和相互关联函数。展望了光学同步干涉相关技术在噪声环境下精确测量随机电磁场的前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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