Juhyuk Park, Dae-Myeong Geum, Woojin Baek, J. Shieh, Sanghyeon Kim
{"title":"Monolithic 3D sequential integration realizing 1600-PPI red micro-LED display on Si CMOS driver IC","authors":"Juhyuk Park, Dae-Myeong Geum, Woojin Baek, J. Shieh, Sanghyeon Kim","doi":"10.1109/vlsitechnologyandcir46769.2022.9830425","DOIUrl":null,"url":null,"abstract":"This work demonstrated the monolithic 3D (M3D) integrated red micro-LED display on Si CMOS driver IC. We achieved a very high pixel density of 1600 PPI by epitaxial layer engineering and low-temperature process design for the micro- display application. M3D sequential integration on pre- fabricated Si CMOS driver IC allows lithographic alignment for the pixel definition, providing high-resolution and the largest emission area per pixel pitch. Furthermore, the low-temperature process provided the lowest standby power among ever reported micro-LED displays. We believe that this work would be one of the milestones for future ultra-high-resolution displays.","PeriodicalId":332454,"journal":{"name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830425","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This work demonstrated the monolithic 3D (M3D) integrated red micro-LED display on Si CMOS driver IC. We achieved a very high pixel density of 1600 PPI by epitaxial layer engineering and low-temperature process design for the micro- display application. M3D sequential integration on pre- fabricated Si CMOS driver IC allows lithographic alignment for the pixel definition, providing high-resolution and the largest emission area per pixel pitch. Furthermore, the low-temperature process provided the lowest standby power among ever reported micro-LED displays. We believe that this work would be one of the milestones for future ultra-high-resolution displays.