Thermal Analysis of ESD Diode in FDSOI Technology using COMSOL Multiphysics

Abstract

Device simulators are well-established tools for behavior prediction of novel electronic structures. However, the developing process for electrostatic discharge (ESD) devices strongly relies on tape-out measurements and adjustments on well-known IPs, rather than on pure TCAD simulation results. Part of the reasons are concerns over accuracy when fast transient events are simulated and high temperatures are reached. This paper provides data on thermal analysis of ESD diode characteristics in fully depleted silicon on insulator (FDSOI) technology using an unorthodox simulation tool – COMSOL Multiphysics.