Fractal modeling of porous semiconductors

V. Aroutiounian, M.Zh. Ghoolinian
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引用次数: 1

Abstract

In the present paper it is shown that one can present the porous semiconductor as a set of clusters of silicon atoms surrounded by SiOx, as well as the single crystalline silicon substrate can be considered as an infinite cluster also. The formulae for the estimation of variable porosity of the material (including the value of critical porosity-- the percolation threshold, after which the characteristic phenomena are expected in porous silicon) and the forbidden bandgap value of clusters are suggested as functions of the sizes of nanocrystallites. A new fractal model of pore creation on the surface of a material is proposed also. The cases of semi-spherical, conical (V-groove dielectric isolation technology) and cylindrical (U-groove dielectric isolation technology) are considered. Formulae for the formed surface area S, material porosity p as a function of the depth and fractal dimension are obtained.
多孔半导体的分形建模
本文证明了多孔半导体可以表现为一组由SiOx包围的硅原子团簇,单晶硅衬底也可以看作是一个无限团簇。提出了材料可变孔隙率的估算公式(包括临界孔隙率的值——渗透阈值,超过该阈值,多孔硅中的特征现象就会出现)和团簇的禁带隙值作为纳米晶体尺寸的函数。提出了一种新的材料表面孔隙形成的分形模型。考虑了半球形、锥形(v型槽介质隔离技术)和圆柱形(u型槽介质隔离技术)的情况。得到了成形表面积S、材料孔隙率p随深度和分形维数的函数表达式。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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