Pattern Wafer x/y Auto Align System using Machine Vision

Abstract

The paper proposes an Automatic Semiconductor Measurement System using Wafer Auto Align using Pattern for semiconductor wafer measurement. The measurement of semiconductors is crucial for the semiconductor industry, and the proposed model aims to improve the semiconductor production automation process. The proposed system consists of three main components: the stage, the vision system, and the pattern alignment algorithm. The stage includes theWafer holder, Ellipsometer, and controller, and plays a critical role in aligning the X and Y axes of the Wafer to 100 mm/s after pattern analysis. The vision system captures highquality images of the Wafer and analyzes the patterns on the Wafer to detect any defects or deviations from the standard. The pattern alignment algorithm uses the information obtained from the vision system to align the Wafer accurately. The Auto align process is fully automated and does not require any user intervention. The process operates in three major steps: selecting the Wafer Recipe, photographing the pattern of the designated recipe, and executing the Auto align. The proposed system offers a comprehensive and automated solution for Wafer alignment and measurement, providing high accuracy and efficiency, while also reducing the risk of errors and improving the semiconductor production process.