Determination of strength of interface in packages based on an approach using coupling of experimental and modeling results

D. Weidmann, G. Dubois, M. Hertl, X. Chauffleur
{"title":"Determination of strength of interface in packages based on an approach using coupling of experimental and modeling results","authors":"D. Weidmann, G. Dubois, M. Hertl, X. Chauffleur","doi":"10.1109/ESIME.2011.5765836","DOIUrl":null,"url":null,"abstract":"The aim of this paper is to present the work we realized to determinate the strength of interfaces in a package. The work consisted of coupling experimental and modelling results obtained on the package. The proposed method is very interesting because it can be directly applied on every package design realized in the field of manufacturing. The process consists of cutting the package in some axes in order to create different stress zones. We study the package before and after cutting by TDM, which provides us the deformation history of the package. Then we also use SAM, a process which allows debonding localisation. By matching and fitting experimental data on simulation, we succeed in determining unknown properties.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"118 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2011.5765836","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

The aim of this paper is to present the work we realized to determinate the strength of interfaces in a package. The work consisted of coupling experimental and modelling results obtained on the package. The proposed method is very interesting because it can be directly applied on every package design realized in the field of manufacturing. The process consists of cutting the package in some axes in order to create different stress zones. We study the package before and after cutting by TDM, which provides us the deformation history of the package. Then we also use SAM, a process which allows debonding localisation. By matching and fitting experimental data on simulation, we succeed in determining unknown properties.
基于实验与建模结果耦合的包装界面强度确定方法
本文的目的是介绍我们在确定包中的接口强度方面所做的工作。该工作包括在包装上获得的耦合实验和建模结果。提出的方法非常有趣,因为它可以直接应用于制造领域中实现的每一个封装设计。该过程包括在某些轴上切割包装,以产生不同的应力区。研究了TDM切割前后的包件,得到了包件的变形历史。然后我们还使用SAM,这是一个允许脱键定位的过程。通过对模拟实验数据的匹配和拟合,我们成功地确定了未知属性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信