{"title":"Determination of strength of interface in packages based on an approach using coupling of experimental and modeling results","authors":"D. Weidmann, G. Dubois, M. Hertl, X. Chauffleur","doi":"10.1109/ESIME.2011.5765836","DOIUrl":null,"url":null,"abstract":"The aim of this paper is to present the work we realized to determinate the strength of interfaces in a package. The work consisted of coupling experimental and modelling results obtained on the package. The proposed method is very interesting because it can be directly applied on every package design realized in the field of manufacturing. The process consists of cutting the package in some axes in order to create different stress zones. We study the package before and after cutting by TDM, which provides us the deformation history of the package. Then we also use SAM, a process which allows debonding localisation. By matching and fitting experimental data on simulation, we succeed in determining unknown properties.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"118 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2011.5765836","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
The aim of this paper is to present the work we realized to determinate the strength of interfaces in a package. The work consisted of coupling experimental and modelling results obtained on the package. The proposed method is very interesting because it can be directly applied on every package design realized in the field of manufacturing. The process consists of cutting the package in some axes in order to create different stress zones. We study the package before and after cutting by TDM, which provides us the deformation history of the package. Then we also use SAM, a process which allows debonding localisation. By matching and fitting experimental data on simulation, we succeed in determining unknown properties.