Development of an advanced thermal interface material for high power devices

Abstract

The cure reactions for conventional flexible epoxy resins are generally slow and have out-gassing and branching site reactions. As a result, these resin types have significant hardening after long-term, high-temperature exposure which makes them unsuitable for thermal interface applications. To address these challenges, a new epoxy resin system has been developed for thermal interface materials (TIMs). The main characteristics of the new resin are: — High thermal stability — No branching — Hydrophobic — Stable at room temperature Development and characterization of a new type of TIM will be discussed.