Verification of thermal analysis of PWBs for RAMCAD

Abstract

Methods involving approximate numerical solutions of the energy equations in two dimensions were developed to allow thermal management and tradeoffs to be conducted efficiently. A validation of the approximate theoretical predictions compared favorably with the experimental data using infrared thermography. Experimental data indicate that infrared thermography provides a method of measuring the temperatures of powered PWBs (printed wiring boards). The overall difference between the measured temperature profile and the calculated temperature profile is within 10%. The discrepancies are thought to be due to uncertainties in material properties and the experimental methods.<>